TAIZHOU EBPU Micro Vickers Knoop Hardness Tester
Price: Contact
Brand: TAIZHOU EBPU PRECISION INSTRUMENTS CO., LTD
Category: Thiết bị đo lường & Kiểm tra
Supplier: AnhNghiSon
Origin: China
0911472255The Micro Hardness Tester engineered and manufactured by TAIZHOU EBPU PRECISION INSTRUMENTS CO., LTD stands as an elite measurement system, meticulously designed for evaluating the mechanical characteristics and structural strength of materials at a microscopic (micro-scale) level. Driven by the modern industrial trends of extreme component miniaturization and advanced surface engineering, conventional macroscopic hardness testing methods fail due to excessive force application which compromises specimen structural integrity. The Micro Hardness Tester from TAIZHOU EBPU provides an ideal, non-destructive validation solution, executing minuscule force applications (measured in grams-force) to create micro-indentations without altering the functional properties or geometrical profiles of ultra-thin or space-constrained parts.
The strategic innovation of this premium testing series is its native dual-methodology framework, supporting the world's two most critical micro-hardness standards simultaneously: the Vickers method (employing a 136° square pyramid diamond indenter) and the Knoop method (utilizing an elongated rhombic diamond indenter with highly asymmetrical diagonal ratios). The addition of Knoop micro-hardness scales offers immense technological advantages when evaluating brittle technical ceramics, semiconductor thin wafers, advanced diamond-like carbon (DLC) coatings, thermal spray layers, or ultra-shallow surface treatments. Under equivalent force loads, a Knoop indenter penetrates to only approximately one-third the depth of a standard Vickers indenter. This vital characteristic eliminates structural fracture risks in brittle coatings and eradicates substrate-effect reading interference (the reading error caused when an indenter penetrates through the thin coating and catches the underlying substrate core hardness). Consequently, industrial engineers receive pure, accurate hardness readings of the thin-film layer itself.
Structurally, the instrument features an ultra-precise force application assembly, effectively absorbing external mechanical vibrations and inertia through high-capacity fluidic dampers or state-of-the-art high-speed electronic load cell tracking modules. The motorized Auto-Turret system executes intelligent, micron-level positional indexing between high-definition optical objectives and the selected diamond indenter immediately following force release. The exceptional optical assembly provides significant magnifications (up to 400x or 500x), routing ultra-sharp microscopic imagery of the indentation through an industrial high-resolution CCD camera directly into dedicated PC analysis software. The software immediately engages automatic edge-detection algorithms, calculating the micro-geometries, interpolating absolute HV/HK readouts, and plotting structural distribution metrics. This workstation is highly regarded for quality assurance and research and development (R&D) operations within semiconductor foundries, advanced micro-electronics cleanrooms, luxury watch manufacturing facilities, aerospace engineering plants, and metallurgy research laboratories.
• Manufacturer: TAIZHOU EBPU PRECISION INSTRUMENTS CO., LTD
• Product Line: High-End Micro Hardness Tester Series
• Supported Testing Methods: Micro Vickers (HV) and Micro Knoop (HK)
• Microscopic Test Force Selection: 10gf (0.098N), 25gf (0.245N), 50gf (0.49N), 100gf (0.98N), 200gf (1.96N), 300gf (2.94N), 500gf (4.9N), 1000gf / 1kgf (9.8N) (Optionally extendable up to 2kgf)
• Indenter Matrix: Co-integrated or interchangeable configurations featuring a 136° Vickers Diamond Pyramid and an asymmetric Knoop Diamond Pyramid
• Turret System Control: Fully motorized Auto-Turret, executing seamless automatic switching between objectives and indenters post test cycle
• Control & Readout UI: High-contrast LCD touch panel or full software interface integration via personal computer
• Total Optical Magnification: 100x (for specimen alignment), 400x / 500x (for high-detail indentation measurement)
• Imaging Unit: High-resolution dedicated industrial CCD/CMOS digital camera with PC interface
• Micro Hardness Measurement Span: 5 HV / HK ~ 3000 HV / HK
• Force Dwell Time Cycle: Adjustable from 0 to 60 seconds with 1-second adjustment resolution
• Micropositioning Stage (XY Stage): High-precision mechanical coordinate coordinate stage; Dimensions: 100x100 mm; Displacement travel: 25x25 mm; Micrometer graduation scale: 0.01 mm (Upgradeable to motorized auto-stage)
• Data Readout Methodology: Automated edge recognition via advanced digital image processing software or manual measuring via electronic digital micrometer eyepiece lines
• Inter-scale Hardness Conversion: Automated algorithmic conversion to standardized scales including HRC, HRB, HRA, HBW, etc.
• Maximum Vertical Clearance for Specimen: 90 mm - 100 mm
• Throat Depth Dimension: 110 mm - 120 mm
• Standard Compliance Framework: ASTM E384, ISO 6507, ISO 4545, JIS Z2244
• Power Configuration: AC 220V, 50/60 Hz
